2017 Asia Pacific Cloud Plus Innovation Industry Summit (Shenzhen)

2017 ASIA PACIFIC TECHNOLOGY INNOVATION EXPO

INVITATION

APCA INTERNATIONAL CONFERENCE

Time: September 6-9, 2017

Venue: Shenzhen Convention and Exhibition Center

Organizer: Asia Pacific Cloud Application Alliance

Asia Pacific Cloud Plus Innovation Industry Summit

We will present you with four wonderful and valuable international forums and activities:

1. Mobile Payment Forum

2   Green Technology Innovation Forum

3   APCA Annual Awards Event

Event Purpose:

1.   to understand the latest innovative technology products

2.   to know more international partners

3.   to find international investment support

4.   to seek international capital listing

5.   to exchange with international experts by face to face

6.   to get opportunities for marketing corporation

Event Invitation:

Our invitation is for those from government agencies,universities, telecommunications, financial (banking, securities, insurance), medical users and cloud applications enterprise, Internet Companies, traditional industry business representatives; international investment institutions and fund representatives, representatives of listed companies.

More information about Asia Pacific Cloud Plus Innovation Industry Summit

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ASIA PACIFIC TECHNOLOGY INNOVATION EXPO

APCA

Asia Pacific Cloud Application Alliance