Asia Pacific IoT Summit successfully held in Hong Kong

Asia Pacific IoT Summit successfully held in Hong Kong

20220801

On July 17, 2022, Asia-Pacific Cloud Application Alliance, as a supporting organization, jointly successfully held the [Asia IOT Summit] at the Hong Kong Convention and Exhibition Center. The summit invited IoT experts and business representatives from the Asia-Pacific region to participate. Everyone gathered together to talk about the innovative technology and future development of the Internet of Things.

Asia-Pacific Cloud Application Alliance also invites representatives of alliance enterprises to attend the summit to obtain the latest IoT information and cooperation opportunities.

20220801

Article Source: APCA

Prev2023 China Smart Office Technology Development Tour Forum (Guangzhou)

NextAPCA Delegation for "10th China Electronic Information Expo" (Shenzhen)

Article classification: APCA News

在线表单

Exhibition & Forum Cooperation

Cooperative institution

Exhibition cooperation

China Optical Expo (Shenzhen)
APCA Innovation Technology Expo (Shenzhen, Hong Kong, Guangzhou)
Digital Technology Innovation Conference (Shenzhen)

Forum cooperation

Data Center Innovation Technology Forum (Shenzhen)
China Smart Office Innovation Technology Application Forum (Shanghai, Beijing, Shenzhen, Guangzhou, Chengdu, Hong Kong)
APCA Annual Innovation Awards Conference (Shenzhen)
Artificial Intelligence, Big Data & the Internet of Things Application Forum (Hong Kong)
Metaverse Innovation Application Forum (Shenzhen)
Digital Technology Innovation Conference (Shenzhen)

Contact

E-mail

WeChat

Verification code

Change Image

Submit

Service Center:

Silicon Valley, Hong Kong, Shenzhen, Guangzhou, Tokyo

Service E-mail:

INFO@APCAO.ORG

Website:

HTTP: WWW.APCAO.ORG

APCA

Asia Pacific Cloud Application Alliance

Alliance Enterprise and Innovation Development